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1

Thermal fatigue failure and design modification of a steam exhaust silencer

Journal:

Engineering Failure Analysis

Year:

1995

Language:

english

File:

PDF, 864 KB

english, 1995

2

Failure analysis and design modification of a briquetting machine roller

Journal:

Engineering Failure Analysis

Year:

1995

Language:

english

File:

PDF, 470 KB

english, 1995

3

A unified model for fatigue crack initiation and growth, with emphasis on short-crack behavior, crack closure effects, variable-temperature fatigue and creep-fatigue interaction

Alan K Miller, Abel O Obabueki, Chu-Hwa Lee, Toshimitsu G Tanaka, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

1988

Language:

english

File:

PDF, 1.56 MB

english, 1988

4

Fatigue failure of welded vertical members of a steel truss bridge

Journal:

Engineering Failure Analysis

Year:

1996

Language:

english

File:

PDF, 419 KB

english, 1996

5

A simple life prediction method for 304L stainless steel structures under fatigue-dominated thermo-mechanical fatigue loadings

Keun-Ho Bae, Hyun-Ho Kim, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2011

Language:

english

File:

PDF, 1.42 MB

english, 2011

6

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.14 MB

english, 2012

7

Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-on-Board Interconnections

Chang-Kyu Chung, Gi-Dong Sim, Soon-Bok Lee, Kyung-Wook Paik

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.36 MB

english, 2012

8

Characterization of Deformation Behaviors and Elastic Moduli of Multilayered Films in Piezoelectric Inkjet Head

Seong-Gu Hong,, Minho Kim,, Soon-Bok Lee,, Chong Soo Lee,

Journal:

Journal of Microelectromechanical Systems

Year:

2008

Language:

english

File:

PDF, 1.08 MB

english, 2008

9

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Kim, Ilho, Lee, Soon-Bok

Year:

2007

Language:

english

File:

PDF, 5.35 MB

english, 2007

10

Fatigue life evaluation of pinion gears for the reliability of pitch systems in wind turbines

Kim, Si-Won, Lee, Yong-Seok, Jang, Dong-Won, Choi, Jungchul, Lee, Soon-Bok

Journal:

Journal of Mechanical Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.30 MB

english, 2017

11

Measurement of Creep and Relaxation Behaviors of Wafer-Level CSP Assembly Using Moiré Interferometry

Ham, Suk-Jin, Lee, Soon-Bok

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 947 KB

english, 2003

12

Validation of the Acoustic Voice Quality Index in the Korean Language

Kim, Geun-Hyo, Lee, Yeon-Woo, Bae, In-Ho, Park, Hee-June, Wang, Soo-Geun, Kwon, Soon-Bok

Journal:

Journal of Voice

Year:

2018

Language:

english

File:

PDF, 1.74 MB

english, 2018

13

Dynamic strain aging effect on the fatigue resistance of type 316L stainless steel

Seong-Gu Hong, Keum-Oh Lee, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

2005

Language:

english

File:

PDF, 348 KB

english, 2005

14

Application of local stress–strain approaches in the prediction of fatigue crack initiation life for cyclically non-stabilized and non-Masing steel

Jae-Yong Lim, Seong-Gu Hong, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

2005

Language:

english

File:

PDF, 889 KB

english, 2005

15

Mechanism of dynamic strain aging and characterization of its effect on the low-cycle fatigue behavior in type 316L stainless steel

Seong-Gu Hong, Soon-Bok Lee

Journal:

Journal of Nuclear Materials

Year:

2005

Language:

english

File:

PDF, 592 KB

english, 2005

16

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 674 KB

english, 2006

17

An experimental technique for the strain measurement of small structures using pattern recognition

Tae-Sang Park, Dong-Cheon Baek, Soon-Bok Lee

Journal:

Sensors and Actuators A: Physical

Year:

2004

Language:

english

File:

PDF, 642 KB

english, 2004

18

Stress analysis and design for a structural fatigue testing machine

Journal:

Journal of Mechanical Science and Technology

Year:

1991

Language:

english

File:

PDF, 840 KB

english, 1991

19

Effect of a brazing process on mechanical and fatigue behavior of alclad aluminum 3005

Kim, Hyun-Ho, Lee, Soon-Bok

Journal:

Journal of Mechanical Science and Technology

Year:

2012

Language:

english

File:

PDF, 335 KB

english, 2012

20

Chip warpage model for reliability prediction of delamination failures

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.51 MB

english, 2012

21

Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

Jae-Won Jang, Kyoung-Lim Suk, Kyung-Wook Paik, Soon-Bok Lee

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.04 MB

english, 2012

22

In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moiré Method With a Pseudo-Phase-Shifting Technique

Jang, Jae-Won, Park, Jin-Hyoung, Lee, Soon-Bok

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.31 MB

english, 2012

23

Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications

Kim, Sanghyeok, Won, Sejeong, Sim, Gi-Dong, Park, Inkyu, Lee, Soon-Bok

Journal:

Year:

2013

Language:

english

File:

PDF, 2.54 MB

english, 2013

24

Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jae-Won Jang,, Kyoung-Lim Suk,, Jin-Hyoung Park,, Kyung-Wook Paik,, Soon-Bok Lee,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.31 MB

english, 2014

25

A Study on the Thermal Fatigue Behavior of Solder Joints Under Power Cycling Conditions

Se Young Yang,, Ilho Kim,, Soon-Bok Lee,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 3.11 MB

english, 2008

26

Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load

Ilho Kim,, Soon-Bok Lee,

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2008

Language:

english

File:

PDF, 1.65 MB

english, 2008

27

Development of a Novel Microimpact-Fatigue Tester and Its Application to Impact Reliability of Lead-Free Solder Joints

Kim, Ilho, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 20.88 MB

english, 2009

28

Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 3.47 MB

english, 2007

29

A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 790 KB

english, 2010

30

2009 Index IEEE Transactions on Components and Packaging Technologies Vol. 32

Park, Jin-Hyoung, Jang, Kyung-Woon, Paik, Kyung-Wook, Lee, Soon-Bok

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 192 KB

english, 2009

31

Measurement and Characterization of the Moisture-Induced Properties of ACF Package

Yoon, Ji-Young, Kim, Ilho, Lee, Soon-Bok

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 1.62 MB

english, 2009

32

A comparison of methods for predicting the fatigue life of gray cast iron at elevated temperatures

Lee, Keum-Oh, Lee, Soon-Bok

Journal:

Fatigue & Fracture of Engineering Materials & Structures

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

33

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Park, Tae-Sang, Lee, Soon-Bok

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 793 KB

english, 2005

34

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Kwon, Woon-Seong, Yim, Myung-Jin, Paik, Kyung-Wook, Ham, Suk-Jin, Lee, Soon-Bok

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 696 KB

english, 2005

35

Fatigue crack growth behavior of Mod.9Cr-1Mo steel at elevated temperatures: Effect of temperature, loading frequency and R ratio

Lee, Jeong-Hwan, Lee, Hyeong-Yeon, Hong, Seong-Gu, Lee, Soon-Bok

Journal:

Journal of Mechanical Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.42 MB

english, 2017

36

A mechanistic model for fatigue life prediction of solder joints for electronic packages

Soon-Bok Lee, Jin-Ki Kim

Journal:

International Journal of Fatigue

Year:

1997

Language:

english

File:

PDF, 596 KB

english, 1997

37

Low cycle fatigue testing of 429EM stainless steel pipe

Samson Yoon, Seong-Gu Hong, Soon-Bok Lee, Bong-Soo Kim

Journal:

International Journal of Fatigue

Year:

2003

Language:

english

File:

PDF, 969 KB

english, 2003

38

The tensile and low-cycle fatigue behavior of cold worked 316L stainless steel: influence of dynamic strain aging

Seong-Gu Hong, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

2004

Language:

english

File:

PDF, 948 KB

english, 2004

39

A new high temperature life correlation model for austenitic and ferritic stainless steels

Keum-Oh Lee, Seong-Gu Hong, Samson Yoon, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

2005

Language:

english

File:

PDF, 187 KB

english, 2005

40

Phenomenological description of cyclic deformation using the overlay model

Samson Yoon, Seong-Gu Hong, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2004

Language:

english

File:

PDF, 289 KB

english, 2004

41

Temperature effect on the low-cycle fatigue behavior of type 316L stainless steel: Cyclic non-stabilization and an invariable fatigue parameter

Seong-Gu Hong, Soon-Bok Lee, Thak-Sang Byun

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 2.03 MB

english, 2007

42

Moisture induced interface weakening in ACF package

Gi-Dong Sim, Chang-Kyu Chung, Kyung-Wook Paik, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2010

Language:

english

File:

PDF, 1.16 MB

english, 2010

43

Realization of high sensitivity displacement field from moiré interferometer with rough phase shifting mechanism and pattern matching technique

Se Young Yang, Soon-Bok Lee

Journal:

Optics and Lasers in Engineering

Year:

2005

Language:

english

File:

PDF, 1.17 MB

english, 2005

44

Dynamic strain aging under tensile and LCF loading conditions, and their comparison in cold worked 316L stainless steel

Seong-Gu Hong, Soon-Bok Lee

Journal:

Journal of Nuclear Materials

Year:

2004

Language:

english

File:

PDF, 868 KB

english, 2004

45

Comparison of prediction methods for low-cycle fatigue life of HIP superalloys at elevated temperatures for turbopump reliability

Keum-Oh Lee, Keun-Ho Bae, Soon-Bok Lee

Journal:

Materials Science and Engineering: A

Year:

2009

Language:

english

File:

PDF, 1.78 MB

english, 2009

46

Fatigue Behavior of Electrodeposited Nanocrystalline Nickel Films

Dong-Cheon Baek, Soon-Bok Lee

Journal:

Procedia Engineering

Year:

2011

Language:

english

File:

PDF, 745 KB

english, 2011

47

Information channel effects on women intention to purchase irradiated food in Korea

Myung-Woo Byun, Sang-Hee Oh, Jae-Hun Kim, Yohan Yoon, Seong-Cheol Park, Hak-Soo Kim, Soon-Bok Kim, Sang-Bae Han, Ju-Woon Lee

Journal:

Radiation Physics and Chemistry

Year:

2009

Language:

english

File:

PDF, 102 KB

english, 2009

48

Crack initiation and growth behaviour of Al 2024-T4 under fretting fatigue

Hyung-Kyu Kim, Soon-Bok Lee

Journal:

International Journal of Fatigue

Year:

1997

Language:

english

File:

PDF, 938 KB

english, 1997

49

Fatigue crack growth behavior of Al7050-T7451 attachment lugs under flight spectrum variation

Jong-Ho Kim, Soon-Bok Lee, Seong-Gu Hong

Journal:

Theoretical and Applied Fracture Mechanics

Year:

2003

Language:

english

File:

PDF, 404 KB

english, 2003

50

Finite-element analysis and X-ray measurement of the residual stresses of ceramic/metal joints

Soon-Bok Lee, Jong-Ho Kim

Journal:

Journal of Materials Processing Technology

Year:

1997

Language:

english

File:

PDF, 698 KB

english, 1997